Introduzione alla tecnologia di lavorazione microporosa
Recently, there is a product to microporous processing technology. After many communications with technical personnel, there are so many programs can do to achieve the desired results. This issue summarizes, share with you.
What’s the micro perforated plate?
La lamiera microforata è costituita da lamiere di vari materiali con fori di diametro molto piccolo realizzati su punzonatrici CNC. Il diametro del foro da 0,2 mm a 2 mm tra la piastra forata è noto come piastra forata microporosa. Il materiale della lamiera forata ha: piastra di ferro, piastra in alluminio, piastra in acciaio inossidabile, piastra di rame e altri materiali diversi di piastra metallica. Lo spessore della piastra è personalizzabile, ma dovrebbe seguire il principio del foro più piccolo, i.e. lo spessore della piastra non deve essere maggiore del diametro del foro.
Microporous perforated plates are widely used in the following applications:
(1) Precision filters, filter plates, filter cartridges, filters for petroleum, chemical, food and pharmaceutical industries.
(2) Metal leakage plate, cover plate, flat pin, lead frame, metal substrate for electronic industry.
(3) Precision optical and mechanical plane parts, spring parts.
(4) Friction plates and other concave-convex plane parts.
(5) Metal labeling plates and metal decorative plates with complex patterns and exquisite handicrafts.
Microporous processing methods:
1, EDM micro-hole processing technology.
EDM micro-hole machining technology has gained wide attention with the continuous expansion of micromechanics, precision machinery, optical instruments and other fields. Due to the EDM micro-hole machining force is small, the processing of the hole diameter and depth by adjusting the advantages of electric parameter control, so that its research in various countries is increasingly active. Tuttavia, EDM is a typical slow processing. In the processing of micro-hole performance is particularly obvious, the time with the improvement of machining accuracy and slow down. For a small number of holes, e.g. around 2 or 5. It is mainly for operations such as drilling holes in molds, which cannot mass-produce and is expensive.
2. Laser processing.
It mainly corresponds to materials below 0.1mm. Laser processing technology has been widely used in the electronics industry. Per esempio, precision electronic components, integrated circuit chip leads and multi-layer circuit board welding; hybrid integrated circuits in the ceramic substrate or gemstone substrate drilling, scribing and slicing; semiconductor processing processes in the laser walk domain heating and annealing; laser etching, doping and oxidation; laser chemical vapor deposition, etc.. Tuttavia, as the microporous processing of metals, the problem with laser is that it produces some blackening. And easy to change the material material, as well as residue is not easy to clean up or can not clean up the phenomenon. It is not a perfect solution for microporous processing. If the requirements are not high, you can try, but for bulk orders, laser processing will not be able to meet the customer’s expectations of delivery and cost.
3. Wire cutting.
This is to take the wire electrode continuous wire supply. That is, the wire electrode completes processing during movement. Perciò, even if the wire electrode is worn out, it can continuously replenish. Perciò, it can improve the accuracy of parts processing. The surface roughness of the workpiece processed by the slow-feeding wire cutting machine can usually reach Ra = 0.8μm and above. And the roundness error, straightness error and size error of the slow walking wire cutting machine are much better than the fast walking wire cutting machine. Perciò, in the processing of high-precision parts, slow-feed wire cutting machine has widely use. Tuttavia, for microporous processing, the use of wire cutting process material is easy to deformation, if the mass production of wire cutting can not cope with. And the price is expensive, customers are generally difficult to accept.
4. etching
Etching is photochemical etching. It refers to the removal of the protective film from the area to etch after exposure and development. In the etching contact chemical solution, the use of two positive graphics from both sides of the chemical abrasion to achieve the role of dissolution, the formation of concave and convex or hollow molding effect. Etching is very specific and refers to controlled corrosion. It is a controll processing method in which metals are chemically process. With the development of electronic technology, more and more need many sets of complex shapes, high precision requirements and machining is difficult to realize the ultra-thin shape of the workpiece. The chemical etching method is easy to achieve parts flat, burr-free, complex graphic requirements, and short processing cycle, basso costo.